Technology:
Apple’s iPhone 5
will make a debut on September 21 in nine countries including the U.S. and
Japan. As Apple introduced a new model, iPhone became thinner. The initial
model launched in 2007 was 12 mm thick, but the 4S launched last year was 9 mm thick. The
competitive edge of a smartphone is the weight and thickness besides the
functions it provides to users, and 40% of parts and materials of a smartphone
is developed by Japanese companies. Teijin dispersed carbon fiber wrapped by
nickel evenly inside the resin used for an exterior part and increased the
ability to prevent the leakage of electromagnetic wave by 50%.
Meiko Electronics
developed a technology to shape a copper film thinner than 0.1 micrometer on a
resin film to be used as the base of a flexible printed board. With this
technology, a flexible printed board can be 30% thinner. The company pasted the
copper film on the resin film using a special material called molecular
junction agent. The new technology decreases the power consumption to a quarter
and the number of working processes. Taiyo Yuden developed a laminated ceramic
coil as small as 0.3 mm wide and 0.6 mm deep, and Murata Mfg decreased the
volume of a laminated ceramic capacitor to one fourth to 0.125 mm wide and 0.25
mm deep. The competition to develop a technology to help a smartphone thinner
and lighter is intensifying.
Flexible printed
boards
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